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fine grinding of silicon wafers

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nanogrinding of sic wafers with high flatness and low. abstract nanogrinding of sic wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels experimental results show that nanogrinding can produce flatness less than 10 m and a surface roughness r a of 042 nm it

fine grinding of silicon wafers

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